Customization: | Available |
---|---|
Type: | Rotor |
Tolerance: | +/-0.02mm |
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Category | Specification |
Material | Electrical engineering steel |
Model Number | OEM |
Type | Stator Rotor Stamping |
Certification | ISO/TS16949, ISO9001:2008, ROHS, SGS |
Surface Treatment | Customized |
OEM&ODM | Accept |
Free Samples | Yes |
Tolerance | +/-0.01mm |
Technology | Laser Cutting/Bending/Stamping/Surface Treatment |
Key Words | Stator rotor stamping |
Testing | 100% inspection before packing/shipping |
Thickness | Custom metal parts (based on customer request) |
Design & Simulation
The stator chip layout is designed using EDA (Electronic Design Automation) tools, incorporating circuitry for motor control, power management, and sensor interfacing.
Simulations verify electromagnetic compatibility (EMC), thermal performance, and signal integrity.
Wafer Fabrication
Silicon Wafer Preparation: High-purity silicon wafers are cleaned and polished.
Photolithography: A photoresist layer is applied, exposed to UV light through a mask, and developed to create circuit patterns.
Etching: Unwanted material is removed via dry (plasma) or wet etching to form transistors and interconnects.
Doping: Ion implantation adjusts electrical properties of silicon regions.
Deposition: Thin films (e.g., SiO2, metal layers) are deposited using CVD (Chemical Vapor Deposition) or PVD (Physical Vapor
Deposition).
Planarization: CMP (Chemical Mechanical Polishing) smooths surfaces between layers.
MEMS Integration (Optional)
For stator chips with integrated sensors (e.g., Hall effect sensors), MEMS (Micro-Electro-Mechanical Systems) techniques create
microscopic mechanical structures on the chip.
Back-End Processing
Dielectric Stacking: Insulating layers isolate metal interconnects.
Metallization: Aluminum or copper layers form electrical pathways.
Passivation: A protective coating (e.g., silicon nitride) shields the chip from moisture and contaminants.
Testing & Dicing
Probe Testing: Electrical probes validate functionality on the wafer.
Wafer Dicing: Laser or diamond saw cuts the wafer into individual dies.
Packaging
The die is bonded to a lead frame or substrate (e.g., QFN, BGA).
Wire bonding or flip-chip connects die pads to package terminals.
Encapsulation with epoxy resin protects against environmental stress.
Final Testing
Burn-In Testing: Chips undergo thermal and electrical stress screening.
Functional Testing: Motor control algorithms, PWM signals, and fault detection are validated.
EMI/EMC Testing: Ensures compliance with electromagnetic standards.
Integration into Motor Assembly
The stator chip is mounted onto the drone motor's PCB, interfaced with coils, rotors, and power sources.
Firmware is loaded to optimize motor efficiency and responsiveness.
1.We are a factory with ODM/OEM customized machining experience.
2.Approx 95% of our product are directly exported to USA/Canada/Australia/UK/France/Germany/Bulgaria/Poland/Italia/Netherlands…Quality assuranced.
3.Most of our machines are purchased from Germany, USA, Japan,for instance, 3-axis and 5-asxis cnc milling machines 6-axis turning machine and so on. so we are able to make high precision parts according to your tolerance requirements.
4.We can well control the surface finish such as polishing/ brush/ sand blasting, Normal anodize/harden anodize,black oxide, plating(Chrome/Nickel/zinc/gold/silver…)
Q1 : Do you customize products according to our design drawings ?